V-Glace
V-Glace The “World’s First” CAE software
About V-glace
[Glass Mold Simulation CAE Software]
The “World’s First” CAE software that can simulate the process of glass mold forming by incorporating glass properties, developed in collaboration with RIKEN. 3D simulation of the glass mold forming process using V-Glace enables process optimization and results analysis.
V-Glace
The software can perform stress analysis, heat transfer analysis, structural relaxation analysis, and viscoelastic analysis of molds and glass during the pressing process at high temperatures.
In particular, it can be used as a guideline for process optimization because it can output virtual temperatures that serve as an indicator of changes in the glass state during the cooling process. As a result, the intuition and experience of skilled workers and the behavior of samples in the mold, which until now have been a black box, can be quantified, contributing to improved quality and productivity through the accumulation of know-how.
Shorten Development Period and Reduce Costs
By performing a simulation before mold design, it is possible to predict correction points such as molds, molding conditions, and preforms. As a result, the number of mold modifications and prototypes can be reduced, contributing to shorter development times and lower costs.
Simulation Samples
We present four sample simulations.It is possible to analyze the heat transfer, shape change, stress time changes, of the glass material in the mold with animation.This allows us to observe the differences in glass material behavior caused by differences in preform geometry and molding patterns.
*Sample shows 1/4 of the whole
Convex Lens
Meniscus Lens
Smartphone Cover Glass
Micro Lens Array
Molding Consultation
We provide consultation on mold shapes, preform shapes, molding process conditions, and other factors to ensure stable production, proposing optimization of the molding process.
MEASUREMENT OF PHYSICAL PROPERTIES
It measures and records the physical property values of samples used in simulations, thereby contributing to more accurate simulations. This includes parameters such as creep, friction coefficient, and structural relaxation, which are essential for the simulations.
Software Environment
Operating System
Windows10 or more
CPU
Intel CPU (Core i series,)
AMD CPU (Ryzen series)(6 cores or more is recommended, multi socket compatible)
Memory
16GB or more is recommended
HDD
1GB (installation area, 500MB or more data area)
Dispaly
Others
3 USB ports are required for USB dongles.
(a USB hub can be used)
About Company
Company name
Integration Technology CO.,Ltd.
CEO
Hiroyoshi Funada
Main Office
Inomata Building (301) 16-2,Honchou,Wako-shi,Saitama,351-0114 JAPAN
Tokyo Office
2F Tomioka Wakura Building , 1-18-17 Tomioka , Koto-ku, Tokyo 135-0047
Location of joint research
2-1, Hirosawa, Wako, Saitama 351-0198, Japan 351-0198 , (RIKEN Research Exchange Building W414)
Telephone number
[Main Office: Wako] 048-486-9605
[Tokyo Office] 03-6264-8312
Shareholder
Hiroyoshi Funada
Advamced Simulation Technology of Mechanics R&D Co., Ltd.
NEXTY Electronics Corporation
Saitama Resona Bank,Limited
TechnoPro, Inc.
Establishment
July 1, 2011
Certification
RIKEN Venture(August 2011)
Contact Us
main office
Inomata Building (301) 16-2,Honchou,Wako-shi,Saitama,351-0114 JAPAN
tokyo office
2F Tomioka Wakura Building , 1-18-17 Tomioka , Koto-ku,Tokyo 135-0047
